Hydrosilex Cutting Compound is the latest formulation of diminishing abrasives providing a medium cut & finish polish for hologram-free results. Engineered specifically for use with dual-action or random orbital polishers. the abrasives break down very consistently to produce the highest depth of gloss. Hydrosilex Cutting Compound is water-based and contains no solvents, like silicones, fillers or petroleum. No dust is produced during polishing which makes for easy clean up and prolongs the life of the polishing pads.